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Brand Name : CUSTOM MADE
Certification : ISO/UL
Place of Origin : China
MOQ : Negotiable
Price : Negotiable
Payment Terms : T/T
Supply Ability : 100000pc/Month
Delivery Time : 4 Weeks
Packaging Details : PCB + Box
Keyword : PCB Manufacturing
PCB Boards : Thick Copper And Aluminum Boards
Features : Producibility, Testability, Maintainability
Applications : Industrial Control, Medical, Consumer Electronics, PCBA Circuit Board, Electronical Products
SMT Capability : 14 million spots per day
Number of layers : 2-64 layers
Materials : Rogers, Nelco, PTFE, M6, TU862, TU872
Surface Finished : HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp
Payment Method : T/T
Whether to Support customization : Support
Logistics : Accept customer specified logistics
Advanced PCB Manufacturing: Diverse Materials & Specialized Processes
PCB Manufacturing Introduction:
Experience the forefront of PCB manufacturing with our comprehensive range of materials, from FR4 to aluminum, copper, ceramic, PI, and PET substrates. Our factory excels in producing boards spanning 1 to 12 layers, boasting a finished plate thickness of 0.07mm and above (with a tolerance of +5%/-6%). With inner layer copper thickness ranging from 18-70μm and outer layer copper thickness from 20-140μm, our products guarantee exceptional performance.
Choose from an array of solder-resist colors and lettering options, and enhance your PCB's functionality with surface treatments like anti-oxidation, HASL, immersion gold, and more. Unlock innovation with specialized processes such as thick copper plating, impedance control, and the creation of single-layer copper foil gold finger plates with varying sides for versatility.
Strengthen your designs with reinforcement options including Pl, FR4, steel sheets, M glue, and electromagnetic shielding film. Our precision extends to compact dimensions, offering a maximum size of 50mm x 100mm, with outer and inner line width/spacing of 0.065mm/3mil. Our commitment to detail is evident in adhering to minimum requirements for solder resist ring width, solder bridge width, solder mask window, and aperture.
Count on our products to maintain impedance tolerance within 10% and shape tolerance within +0.05mm G laser +0.005mm. Our flexible forming methods include V-cut, CNC, and punching. Join us in shaping the future of electronics with these precise, versatile, and dynamic PCB offerings.
PCB Manufacturing Parameters:
Item | Technical Parameter |
Layer | 2-64 |
Thickness | 0.3-6.5mm |
Copper Thickness | 0.3-12 oz |
Min Mechanical Hole | 0.1mm |
Min Laser Hole | 0.075mm |
HDI | 1+n+1,2+n+2,3+n+3 |
Max Aspect Ratio | 20:01 |
Max Board Size | 650mm*1130mm |
Min Width/Space | 2.4/2.4mil |
Min Outline Tolerance | ±0.1mm |
Impedance Tolerance | ±5% |
Min PP Thickness | 0.06mm |
Bow &Twist | ≤0.5% |
Materials | FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872 |
Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP |
Special Capability | Gold Finger Plating, Peelable, Carbon ink |
PCB Manufacturing Process:
1. Gold-plating process: the vertical HASL process is very difficult to flatten very thin pads, which brings difficulty to SMT placement. In addition, the shelf life of the HASL is very short, and gold-plating just solves the problem. these problems.
2. Immersion gold process: The purpose of the immersion gold process is to deposit a nickel-gold coating with stable color, good brightness, flat coating and good solderability on the surface of the printed circuit board. Basically, it can be divided into four stages: pre-treatment (oil extraction, micro-etching, activation, post-immersion), nickel immersion, gold immersion, and post-treatment (waste gold washing, DI washing, drying)
3. Leaded HASL: Leaded eutectic temperature is lower than lead-free, the specific amount depends on the composition of the lead-free alloy, such as the total gold of SNAGCU 217 degrees, the soldering temperature is the eutectic immersion plus 30 degrees or 50 degrees, It depends on the actual adjustment, the lead eutectic is 183 degrees, the mechanical strength, brightness, etc. are better than lead-free.
4. Lead-free HASL: lead will increase the activity of tin wire in the soldering process, lead-tin wire is better than lead-free tin wire, but lead is poisonous, long-term use is not good for human health, and lead-free tin will It is brighter than lead-tin melting, so the solder joint is much stronger.
5. SOP (anti-oxidation): It has anti-oxidation, thermal shock resistance, and corrosion resistance. It is used to protect the copper surface from rusting (oxidation or carbonization) in a normal environment: but in the subsequent welding high temperature, this protection The film must be easily removed quickly by the flux so that the exposed clean copper surface can be melted and soldered immediately in a short time to become a firm solder joint.
PCB Manufacturing Advantages:
1. From PCB proofing to SMT placement, one-stop solution, reducing R&D costs and accelerating product launch.
2. Quick quotation and quick response.
3. The delivery date is fast, and the on-time delivery rate is over 95%
4. Excellent materials, advanced equipment, and strict quality system 5. Exclusive customer service one-to-one service, seamless connection throughout the process
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PCB Assembly Manufacturer HASL PB Free Immersion Gold/Tin/Silver OSP Surface Finished Images |